Feasibility of combining monolithically integrated silicon photonics with low cost, high performance, non-hermetic surface-mount technology (SMT) packaging

This project aims at experimentally validating the commercial viability of a new silicon photonics design which provides state of the art monolithic integration of various CMOS control electronics and BiCMOS high speed RF drive electronics which may be combined with high bandwidth non-hermetic SMT packages capable of withstanding standard high volume solder reflow processes.