Process Development of Volatile Cobalt ALD Precursors

Cobalt thin-films have found widespread applications in microelectronics devices; such as liners in copper interconnects, wetting layers, and caps, in addition to applications for magnetic devices and CoSi2 contacts. CVD and ALD techniques are typically used to achieve cobalt films between 2-5 nm thick with excellent conformalities and negligible resistance increase. Leading precursors for cobalt thin-film deposition include cyclopentadienylcobalt dicarbonyl and dicobalt(hexacarbonyl)tert-butylacetylene.