Tailoring Microencapsulation Strategies for New Applications
The application of microencapsulation technology provides for separation between reactives and curatives, allowing 2-part systems such as adhesives, to be formulated and applied with the inherent stability of a 1-part system. Release and subsequent curing can be controlled to occur “on demand”, for example upon the mechanical fastening of a screw, which results in capsule rupture. This is often highly dependent on the careful design of a specific system. With the aim of capitalizing on new product opportunities that are not compatible with the current microencapsulation process, this project will involve a fundamental study of the encapsulation process and the role of materials sets in the properties of the resulting microcapsules. The effects of these material sets as well as processing conditions on the properties of the products including rate of curing, thermal and environmental stability, adhesive strength, and mechanical properties will be studied. This knowledge will lead to a new level of predictability in microcapsule formation, thereby enabling the rational design of microcapsules, which will in turn accelerate the development of new products.