Microelectromechanical Low-power Strain Sensor for structural health monitoring applications – Phase 2

Structural health monitoring (SHM) of airplanes requires very compact and low-power stain sensors. Therefore, IPR wants to investigate how a commercial micro-fabrication process can be used to implement its MEMS sensor design, particularly using the electro-conductive properties of doped silicon vs. metal-coated crystalline silicon or polysilicon. The project will consist of a conceptual study of the current design provided by IPR and the design and evaluation through simulations of that design implemented in different technology. Moreover, design variants of different geometries will be investigated.
This project aims at the design of an adapted sensor for the PiezoMUMPS and PolyMUMPS offered by the MEMSCAP foundry and the investigation of several design variants to improve yield and performance. Moreover, it will also provide a custom process flow that could be implemented as an alternate approach to fabrication at the C2MI.

Alberto Prudhomme Buelna
Superviseur universitaire: 
Frédéric Nabki
Partner University: