The Role of Surface Oxidation on the Behaviour of Metal Alloy Microparticles in Electronics Assembly

Solder paste is a material that is approximately 90 % metal alloy powder by weight and 10 % flux medium, a material consisting of organic compounds whose principal function is to remove oxide from the powder surface, is used in the assembly of electronic devices. This material is printed onto circuit boards, after which components are mounted onto them. The assembly is then passed through an oven in a process known as reflow fusing components to the board. The effect of the powder’s surface characteristics on paste behaviour is poorly understood. This research project aims to take advantage of high-resolution surface characterization techniques to establish a link between the composition and thickness of the powder’s surface oxide and the solder paste behaviour.

Faculty Supervisor:

Daniel Guay

Student:

Partner:

AIM Metals and Alloys LP

Discipline:

Physics

Sector:

Manufacturing

University:

Université du Québec : Institut national de la recherche scientifique

Program: