Thermal Enhancement Packaging

Continuing progress in microelectronics today relies to a great extent on the ability of industrials to tightly integrate together different types of devices and integrated circuits, a practice known as heterogeneous packaging integration. These packages are used many everyday applications such as smart phone and social media. The increase performance of these packages come at a cost of increase power consumption and thus heat management to dissipate the energy that was not used for the actual calculation and communication. The proposed project proposed to investigate better thermal solutions. In order to do so, a better understanding of the temperature within the package is required. To achieve this goal, metallic heat dissipation element will be instrumented using thermal sensors to evaluate the thermal performance of the different package structure.

Faculty Supervisor:

Dominique Drouin

Student:

Partner:

Centre de Collaboration MiQro Innovation (Bromont, QC)

Discipline:

Engineering

Sector:

Manufacturing; Professional, scientific and technical services

University:

Université de Sherbrooke

Program: