Versatile Systems-on-Chip Integration to Reduce Aircraft Weight and Gas Emission (VairCRAFT)

The aeronautic and aerospace industries are exploring new approached to reduce the mass of cables, bulky electronic systems. This rationally leads onto aircraft weight reduction as well as the amount of CO2 and greenhouse gas emitted by aircrafts. To reduce the mass of cables, merging/embedding different electronic systems in a single chip is an alternative. In this approach, massive electronic modules are miniaturized in a so-called SoC. Different SoCs can be embedded in a single package called SiP. Having had such techniques, it is anticipated to lower the number of bulky devices in an aircraft resulting in reduce amount of green house gass.

Faculty Supervisor:

Mohamad Sawan;Benoit Gosselin;Ahmed Lakhssassi;Yvon Savaria;Ahmed Lakhssassi;Benoit Gosselin;Yvon Savaria

Student:

Partner:

Thales Canada Inc (St. Laurent, QC)

Discipline:

Engineering

Sector:

Education; Manufacturing; Professional, scientific and technical services

University:

École Polytechnique de Montréal; Polytechnique Montréal; Université du Québec en Outaouais; Université Laval

Program: