Advanced thermal simulation for mold and die

With newer manufacturing technologies, the need to find the optimum cooling or heating patterns in molds is more important than ever before. The industry has not taken full advantage of solutions available to them in building new and improved manufacturing processes. This project aims to develop, validate and optimize the computer simulation results for cooling and heating with the use of Siemens FloEFD software. It is aimed to develop best practices for conformal cooling application which is for cooling 3D printed components. This application requires 3D printing or additive manufacturing techniques to build more sophisticated and efficient molds. Since, the field is relatively quite new it is intended to bridge the gap in the industry and software technology platform. The intern will be benefited by getting first hand industry experience and commonly with the industry partner be a part of future proofing Canadian tooling and mold industry.

Faculty Supervisor:

Chao Zhang

Student:

Partner:

Longterm Technology Services Inc

Discipline:

Engineering

Sector:

Professional, scientific and technical services

University:

The University of Western Ontario

Program: