Intelligent modular electromagnetic mapping instrument for non-contact material characterization

The main objectives of the project are designing, developing, and integrating a high-resolution electromagnetic mapping instrument, with interchangeable sensor arrays or sensor suites for single-sided access, non-contact characterization of materials, by evaluating different electromagnetic properties (i.e., electric conductivity, magnetic permeability, dielectric constant) while using an intelligent modular architecture.
Sustainability of new and improved manufacturing methods, one of the main objectives of the Advanced Manufacturing cluster program, can only be assured though repeatable processes and quality of the resulting parts. In the aerospace industry, introduction of new manufacturing processes (i.e., additive manufacturing) and novel materials are required to demonstrate fitness for purpose. Sensing is simultaneously at the heart of characterization of new materials and maintenance of existing structures. Electromagnetic sensing has a wide variety of applications, as electric and magnetic material properties could identify discontinuities that are or would be detrimental to a part, component, or structure under certain operating conditions or in certain environments. the goal of this project is to develop and integrate electromagnetic sensing instrumentation that would allow for fast, accurate, and non-destructive evaluation of metallic and non-metallic structures, with multi-technique and multi-sensor competencies, that could be deployed both in the lab and in an industrial setting.

Faculty Supervisor:

Thomas Krause

Student:

Partner:

Rheinisch-Westfälische Technische Hochschule Aachen

Discipline:

Engineering

Sector:

Education

University:

Royal Military College of Canada

Program: