Spinal disorders are the largest cause of years lived with disability globally. Artificial disc replacement (ADR) is a common surgical approach to address dis degeneration, but reoperation rates can remain as high as 20%. Mechanical analysis of on-market designs and discussions with spine surgeons suggest this is linked to the mechanical design of the implants […]

Craft breweries depend heavily on their brewmasters to forecast demand and plan production, which distracts them from their core focus: brewing good quality beer. It also puts significant pressure on breweries because if the brewmaster suddenly becomes unavailable, they would be incapable of effectively completing these tasks. Forecasting and production planning become increasingly difficult as […]

This project will explore the market potential of a new technology that uses advanced artificial intelligence, powered by both classical and quantum methods, to help companies discover new materials faster and more efficiently. The intern will work closely with mentors and industry experts to identify which industries can benefit the most from this innovation and […]

The proposal seeks to improve the technology readiness of a new family of printable (liquid-based) ink formulations designed for the advanced manufacturing sector. These chelated sol-gel materials have a low viscosity, allowing their use in a commercial digital inkjet-printing equipment. Most importantly, they are designed to offer the unique ability to convert from liquid to […]

Dental caries can increase in severity if left untreated and result in deep carious lesions. Repairing these deep carious lesions routinely involves pulp capping, a procedure during which the tooth pulp can be accidentally exposed, allowing bacteria to enter the pulp and cause infection. Pulp capping failure rates are high, and retreatment may involve root […]

Laser-driven plume formation is a surprising and so far theoretically unpredicted phenomenon of Newtonian fluids. The group at the Max Planck Institue for the Structure and Dynamics of Matter (MPSD) have observed this behaviour in glycerol, a Newtonian fluid, whereby elastic, rubber-like responses in the material have been produced on timescales many orders of magnitude […]

Dans le cadre d’un projet de recherche, des micro-commutateurs MEMS ont été fabriqués sur une ligne de prototypage industrielle 200 mm. Ces dispositifs millimétriques sont compacts et consomment très peu d’énergie, ce qui les rend particulièrement intéressants pour des environnements cryogéniques nécessitant une dissipation de chaleur minimale. Ce projet vise à évaluer les performance et […]

Denture assemblies are oral appliances or prosthetic devices to replace missing teeth and restore oral function, speech, and aesthetics. The dentures market is driven by the senior population and demand, which is expected to grow by 68% in the next 20 years according to the Canadian Institute for Health Information. This demographic also often suffer […]

The proposed scientific collaboration is toward developing a new class of porous structure using mathematical design. The structure must be lightweight and capable of removing heat. This structure is advantageous in engineering, such as heat enhancement, heat exchangers, and biomedical engineering (hip, jaw, or femur replacement). The global importance of the proposed research is in […]

The project concentrates on MEMS (Micro-Electro-Mechanical Systems) fabrication process optimization. MEMS devices comprise suspended structures, such as cantilevers, gyros, membranes, etc., which are created by removing sacrificial material around them in order to have these structures released to perform their designated function. Currently, these structures are being released with the use of either dry etch […]

Global transition to a digital society has billions using microelectronic technology in their day-to-day activities. The increasing demand for miniaturization, speed, and reliability must be satisfied with a compact combination of multiple microchips. The technical constraints are quickly surpassing the capabilities of conventional circuit boards. Thus, silicon interposers, a high-cost, high-performance packaging solution for integrating […]

Advanced packaging and high-density chip stacking technologies are pivotal in the evolution of microelectronics, enabling enhanced performance through heterogeneous integration. Hybrid bonding interconnection has increasingly been recognized as the unique bonding method that meets the demands for high-density chip stacking. Cu/SiO2?hybrid bonding is the standard packing interface recently introduced in the industry. However, it faces […]