Le projet de recherche proposé se concentre sur le développement de robots capables d’interagir de manière sécurisée et efficace avec des humains et avec leur environnement. Le stagiaire travaillera sur la réduction de l’inertie des bras robotiques en utilisant des mécanismes innovants. Les résultats attendus de ce projet incluent une meilleure sécurité et performance des […]

Le stagiaire participera au développement d’un bracelet intelligent visant à améliorer la mesure de la pression artérielle (PA) en y intégrant un capteur d’électrocardiogramme (ECG). Ce projet repose sur les travaux d’une doctorante qui développe un dispositif innovant pour suivre la PA au quotidien, et d’une postdoctorante qui cherche à affiner la précision des modèles […]

In this project, we will utilize thermal feedback for target position identification in a virtual environment, e.g., allow users to know the location and distance of a virtual object with respect to their position based on the location and intensity of the thermal feedback. Our goal is to design and develop a new VR application […]

L’aluminium, utilisé dans les secteurs des transports pour ses caractéristiques de légèreté et de robustesse, se trouve souvent sous forme d’extrusions comme les poutres de châssis et de carrosserie. Toutefois, les propriétés des pièces extrudées varient fortement en fonction des conditions de fabrication, telles que la température et la vitesse de déformation, ce qui entraîne […]

Development of a system (template, plugin, API) to integrate cloud based services such as GIS, IoT and interactive gaming streams into a browser based user interface.

Les prothèses myoélectriques permettent aux personnes amputées de contrôler un bras artificiel en captant les signaux électriques des muscles, appelés signaux électromyographiques (EMG). Cependant, ces prothèses restent limitées par des variations de ces signaux, causées par des facteurs comme la sueur, la fatigue ou le déplacement des électrodes, ce qui entraîne des pertes de précision […]

The project concentrates on MEMS (Micro-Electro-Mechanical Systems) fabrication process optimization. MEMS devices comprise suspended structures, such as cantilevers, gyros, membranes, etc., which are created by removing sacrificial material around them in order to have these structures released to perform their designated function. Currently, these structures are being released with the use of either dry etch […]

HPN is building a hyperautomation platform using data science, artificial intelligence (AI), and machine learning (ML) techniques to hyperscale its unique business model. The expected outcomes from this platform will be scale up of revenue internationally along with improved operating margins; enhanced member and customer experience through self-service and AI concierge services; and innovation in […]

Off-site construction involves prefabricating building components in a controlled environment, allowing for enhanced efficiency, quality, and sustainability. This research addresses critical challenges in the development of manufacturing facilitylayoutsfor Roberts Group, Prince Edward Island(PEI). By employing digital simulation approaches, the project aims to design and optimize factory layouts and workflows, reducingmaterial and streamline production processes to […]

Spot application of pesticides is one aspect of precision agriculture technology that may have promising economic, environmental and social benefits. However, the practical application of this technology is faced by several challenges including accurate detection of pests, simultaneous control of multiple nozzles, and formulation of suitable droplets under continuous opening and closure of nozzles. This […]

Global transition to a digital society has billions using microelectronic technology in their day-to-day activities. The increasing demand for miniaturization, speed, and reliability must be satisfied with a compact combination of multiple microchips. The technical constraints are quickly surpassing the capabilities of conventional circuit boards. Thus, silicon interposers, a high-cost, high-performance packaging solution for integrating […]

Advanced packaging and high-density chip stacking technologies are pivotal in the evolution of microelectronics, enabling enhanced performance through heterogeneous integration. Hybrid bonding interconnection has increasingly been recognized as the unique bonding method that meets the demands for high-density chip stacking. Cu/SiO2?hybrid bonding is the standard packing interface recently introduced in the industry. However, it faces […]