There is no memorandum project overview associated with this application.
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There is no memorandum project overview associated with this application.
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There is no memorandum project overview associated with this application.
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There is no memorandum project overview associated with this application.
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Compound semiconductors are widely used in a variety of consumer products such as TVs, smartphones, lighting modules, as well as in high-performance applications, e.g. medical imaging. The reliability and performance of such devices strongly depends on the purity of the base materials. This project proposes a systematic investigation of the impact of the level and […]
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The project is a partnership between Polytechnique Montréal, HEC Montréal, UQAM and JDA Canada. JDA Labs is investigating new approaches to help incorporate “big data” science and analytics into everyday supply chain decisions. It relies on new approaches that employ sensor technologies, new analytic capabilities and simulation techniques to not just sense and respond, but […]
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Several studies have shown that water levels of the Great Lakes would inevitably decline in a warmer climate. These studies were based on a modeling system that was not accounting for two-way exchanges of water and energy between the atmosphere and the earth surface, hence excluding key feedback mechanisms. The general objective of this project […]
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There is no memorandum project overview associated with this application.
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There is no memorandum project overview associated with this application.
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There is no memorandum project overview associated with this application.
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Les organisations de haut savoir font face à un défi d’envergure : le départ à la retraite dans un futur proche d’un nombre important de cadres dirigeants et experts dont elles dépendent grandement. Ce projet de recherche a pour but de mettre en lumière les principaux enjeux liés au transfert des connaissances et de munir […]
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La fabrication additive par soudage ultrasons combine la soudure par ultrasons de métaux et l’usinage de ces derniers à l’intérieur du même appareil. Cette méthode de mise en oeuvre est principalement présente dans les domaines de l’aéronautique, de l’aérospatiale, de l’automobile et de l’électronique. Il s’agit d’un type de soudure dit « à froid » […]
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There is no memorandum project overview associated with this application.
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