Copper is an important metal for microelectronics: it acts as interconnects (i.e., the wiring) between the devices in the microchip. As microchips get smaller, it is more difficult to make this wiring by traditional methods. Thus, a new technology (atomic layer deposition, ALD) is positioned to enable the deposition of copper when interconnects need to be formed on the nanoscale. Presently, there is no ALD process that adequately deposits copper with the necessary conductivity to act as an interconnect.