Innovative fabrication processes and materials for next generation semiconductor devices

As distributed sensors for the Internet of Things and portable electronics continue to gain in importance, advanced materials and processing technologies for create the next generation semiconductor devices gain in importance. This Mitacs aims to develop
materials and processes to allow new functions in these devices, such as energy harvesting to power wireless devices and efficient RF circuits for their communication. More specifically, piezoelectric materials and the processes to fabrication them on industrial-grade tools for 200 mm wafers will be developed, along with their characterization methods. In addition, advanced wafer bonding approaches to allow
wafer-scale packaging of MEMS sensors and their integration with microelectronics will be developed. Our understanding of the underlying material and interface physics central to these processes will also be improved.

Faculty Supervisor:

Hassan Maher;Luc Fréchette

Student:

Partner:

Centre de Collaboration MiQro Innovation (Bromont, QC)

Discipline:

Engineering

Sector:

Manufacturing; Professional, scientific and technical services

University:

Université de Sherbrooke

Program: