Polymer hybrid bonding for microelectronic assembly

Advanced packaging and high-density chip stacking technologies are pivotal in the evolution of microelectronics, enabling enhanced performance through heterogeneous integration. Hybrid bonding interconnection has increasingly been recognized as the unique bonding method that meets the demands for high-density chip stacking. Cu/SiO2?hybrid bonding is the standard packing interface recently introduced in the industry. However, it faces several challenges. Its low bonding strength due to interfacial water trapping can lead to delamination and failure under stress. Moreover, the overall process requirements – such as temperature, surface roughness, and cleanness – are incompatible with a reconstituted wafer.
This project focuses on polymer-based hybrid bonding technology to enable finer-pitch interconnections. Specifically, it aims to reduce surface cleaning requirements and simplify the manufacturing process. Replacing SiO2 with a polymer dielectric is anticipated to mitigate these issues due to the polymer’s softer mechanical properties, which can absorb contaminant particles into their matrix without damaging the bonding interface. This project proposes the development of polymer bonding processes to achieve the desired packaging interface. Detailed investigations on materials and processing challenges will be conducted to realize successful Cu/polymer hybrid bonding.

Faculty Supervisor:

Dominique Drouin

Student:

Partner:

Université de Toulon

Discipline:

Engineering

Sector:

Advanced Manufacturing; Nanotechnology; Technology

University:

Université de Sherbrooke

Program: