SI INTERPOSER PLATFORM FOR QUANTUM APPLICATIONS

Global transition to a digital society has billions using microelectronic technology in their day-to-day activities. The increasing demand for miniaturization, speed, and reliability must be satisfied with a compact combination of multiple microchips. The technical constraints are quickly surpassing the capabilities of conventional circuit boards. Thus, silicon interposers, a high-cost, high-performance packaging solution for integrating multiple kinds of chips, have gained popularity in research and commercialization. This proposal will develop and prove the first low-cost, accessible silicon interposer technology made-in-Canada.
This project aims to develop ultra-compact systems on interposer to advance the state of the art in quantum technology. As a result of this project, an established Canadian supply chain for interposers, involving national innovation facilities and university labs, will continue delivering this critical tool to enable the growing digital economy and to boost international competitiveness for over 10,000 microsystems developers in Canada.

Faculty Supervisor:

Dominique Drouin;Marie-Josée Gour

Student:

Partner:

Université de Toulon

Discipline:

Engineering

Sector:

Advanced Manufacturing; Nanotechnology; Technology; Quantum Science

University:

Université de Sherbrooke

Program: