Alternative approaches to curing flip chip underfill encapsulants

The volume of data being transmitted (streaming, blockchain, machine learning, etc.) continues to increase exponentially. To carry this data, the traditional metallic transmission systems (typically copper) are being replaced with light-based (photonic) medium to reduce both the space and power consumption. This implies integrating photonic/optical components within the microelectronics infrastructure for electrical to optical conversion and optical interconnection. A key area of focus to bring such technology to the mainstream is the connection of multiple optical fibers to the microelectronic package using a photonic integrated circuit (PIC) as the interface. To accomplish such fiber connections at high densities yet in a highly automated, cost-effective fashion, the PIC chip must be maintained extremely flat in the region of connection, yet the material sets and processes inherent to the microelectronic package are conducive to stresses that bend (warp) both the package and the chips therein, including the PIC.

Faculty Supervisor:

David Danovitch

Student:

Partner:

Université de Toulon

Discipline:

Engineering

Sector:

Advanced Manufacturing; Other; Nanotechnology

University:

Université de Sherbrooke

Program: