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Design Tools for Next Generation of Microelectronics Cooling Solutions –Characterization, Modeling and Optimization
There is an increasing trend towards miniaturization in the microelectronics industry which increases
the power density and thus heat generated from these devices. Consequently, one key factor limiting
reliability and higher performance of electronic devices is the heat removal, to maintain the device
below its maximum operating temperature. This indicates the importance of devising efficient cooling
strategies to meet the demands of the electronics sectors. The goal of this program is to develop and
implement state-of-the-art cooling solutions for Analytic Systems’ products. In this project, theoretical
models and simulations will be developed to accurately analyze and predict operating temperature and
performance of the existing cooling solutions in Analytic Systems’ products. A comprehensive
experimental program will be conducted to test and verify the developed models/simulations in close
collaboration with Analytic Systems (AS). The developed models will then be used to optimize the
current designs and develop efficient cooling strategies for AS products.
During the first-phase of this program, the primary focus will….TOBECONTINUED
Faculty Supervisor:
Majid Bahrami
Student:
Partner:
Analytic Systems
Discipline:
Engineering
Sector:
Manufacturing
University:
Simon Fraser University
Program:
Accelerate
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