Development of In-Situ Characterization tools for Spatial Atomic Layer Deposition System

Atomic Layer Deposition (ALD) is a popular tool for the deposition of thin film materials that are common in solar cells, sensors and display technologies. However, the need for a vacuum environment and slow material growth rates restricts ALD applicability in large scale commercial and industrial materials production. Atmospheric Pressure Spatial Atomic Layer Deposition (AP-SALD or SALD) is a variant of ALD in which thin film materials are deposited without the need of a vacuum environment and with the added benefit of quicker deposition rates. While SALD mitigates the problem of scalability, it also presents a unique opportunity for the learning of material properties as the film is deposited. This in-situ characterization, allows for quantitative tuning of the material property to an optimal value in real time via SALD process parameters. TO BE CONT’D

Faculty Supervisor:

Kevin Musselman


Kissan Mistry



Engineering - mechanical



University of Waterloo



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