Optimization of micropillar microfabrication process for heterogeneous integration

Advanced packaging and high-density chip stacking technologies are pivotal in the evolution of microelectronics, enabling enhanced performance through heterogeneous integration. As the industry moves toward reducing bump size and pitch, the bonding methodology has shifted from solder balls to Cu pillars. Although Cu pillars with solder caps have successfully replaced solder bumps, they encounter technical limitations below 30?µm pitch, introducing new challenges, particularly in terms of thermomechanical strength, electromigration resistance, and warpage accommodation.
This project aims to develop high-density (

Faculty Supervisor:

Dominique Drouin

Student:

Partner:

Université Grenoble Alpes

Discipline:

Engineering

Sector:

Education

University:

Université de Sherbrooke

Program: