System-on-Chip-based Sensor Interfaces With Thermal Management for Aerospace Applications

Nowadays, aircrafts use computer-regulated flight control systems that replace mechanical controls with electronic interfaces. These sensor interfaces convert physical movements or quantities (temperature or pressure for instance) to electronic signals between flight control computers (FCCs) and actuators and sensors. A large number of sensor interfaces are used in an aircraft to allow FCCs communicating with electromagnetic-based actuators and sensors. Their cost, size, weight, and power (CoSWaP) should be optimized. Moreover, these interfaces are connected to different loads and sensors in the aircraft that typically have their own requirements. Therefore, sensor interfaces should be adjusted for different needs. Redundancy and lack of versatility/flexibility motivate interfaces’ manufacturers to look for ways to reduce CoSWaP by shrinking the size of components and making sensor systems more flexible. This helps to ease maintenance and gain economic benefits.
This project aims at leveraging advanced system-on-chip (SoC) integration technologies to implement senor interfaces for aerospace applications. In this technology, low and high-voltage electronic modules are integrated in a single microelectronic chip, which reduces CoSWaP. Means of programming and configuring these interfaces will be developed to allow adjusting SoCs to specific target uses of the proposed sensor interfaces.

Faculty Supervisor:

Yvon Savaria;Ahmed Lakhssassi;Ahmad Hassan;Yvon Savaria;Benoit Gosselin;Ahmad Hassan

Student:

Partner:

Thales Canada Inc;Mitacs - Vancouver

Discipline:

Engineering

Sector:

Manufacturing; Professional, scientific and technical services

University:

Polytechnique Montréal; Université du Québec en Outaouais

Program: