Development of Novel Chemistry for Copper Deposition by ALD

(Overview from original project, awaiting updated memo from Justin)

Copper is an important metal for microelectronics: it acts as interconnects (i.e.,
the wiring) between the devices in the microchip. As microchips get smaller, it is
more difficult to make this wiring by traditional methods. Thus, a new technology
(atomic layer deposition, ALD) is positioned to enable the deposition of copper
when interconnects need to be formed on the nanoscale. Presently, there is no
ALD process that adequately deposits copper with the necessary conductivity to
act as an interconnect.
This research will develop a family of copper-containing compounds that show
excellent characteristics for ALD. This family of compounds have been defined
in a provisional patent application, and this one term internship will provide the
improvements that this technology needs to demonstrate its excellence as a
premiere copper precursor

Faculty Supervisor:

Sean Barry

Student:

Partner:

Foward Water Technologies;GreenCentre Canada

Discipline:

Physics

Sector:

Manufacturing

University:

Carleton University

Program: