Development of lead-free solder alloys for electronic assembly Year Two

Recent environmental concerns and legislations over the use of lead are driving the microelectronics industry towards intensive search for lead free solder alloys in electronic packaging. Among many lead free solders, Sn-Cu-Ag system has been regarded as the most promising and attractive candidate alloy system for the conventional Sn-Pb solder alloys, owing to its wettability […]

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