Development of Novel Chemistry for Copper Deposition by ALD

Copper is an important metal for microelectronics: it acts as interconnects (i.e., the wiring) between the devices in the microchip. As microchips get smaller, it is more difficult to make this wiring by traditional methods. Thus, a new technology (atomic layer deposition, ALD) is positioned to enable the deposition of copper when interconnects need to […]

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